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     DHG 10 I 600PA advanced IRMS A per pin* 35 RthCH K/W 0.50 MD Nm 0.6 mounting torque 0.4 Tstg °C 150 storage temperature -55 Weight g 2 Dim. Millimeter Inches Min. Max. Min. Max. A 12.70 14.73 0.500 0.580 B 14.23 16.51 0.560 0.650 C 9.66 10.66 0.380 0.420 D 3.54 4.08 0.139 0.161 E 5.85 6.85 2.300 0.420 F 2.54 3.42 0.100 0.135 G 1.15 1.77 0.045 0.070 H - 6.35 - 0.250 J 0.64 0.89 0.025 0.035 K 4.83 5.33 0.190 0.210 L 3.56 4.82 0.140 0.190 M 0.51 0.76 0.020 0.030 N 2.04 2.49 0.080 0.115 Q 0.64 1.39 0.025 0.055 Symbol Definition Ratings typ. max. min. Conditions RMS current thermal resistance case to heatsink Unit * Irms is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip. In case of 1, a common cathode/anode configuration and a no n-isolated backside, the whole current capability can be used by connecting the backside. Outlines TO-220AC F C N 60 mounting force with clip 20 IXYS reserves the right to change limits, conditions and dimensions. ? 2006 IXYS all rights reserved 0614 * Data according to IEC 60747and per diode unless otherwise specified |